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The AS_NRF51 FleX-BLE IC from American Semiconductor employs Nordic’s nRF51822 SoC to deliver a flexible connectivity solution for wearable, IoT, and more.
April 24, 2019
By: Anthony Locicero
Copy editor, New York Post
Nordic Semiconductor said that Boise, ID-based American Semiconductor, selected Nordic’s nRF51822 Bluetooth Low Energy (Bluetooth LE) System-on-Chip (SoC) for its ‘AS_NRF51 FleX-BLE’, a flexible integrated circuit (IC) that supports Bluetooth LE wireless connectivity in what American Semiconductor claims is the world’s thinnest and smallest Chip Scale Package (CSP). The AS_NRF51 Flex-BLE is an ultra-thin version of Nordic’s nRF51822 SoC wafer-level CSP (WL-CSP), employing American Semicond...
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